| PART |
Description |
Maker |
| 35730-7200 0357307200 |
3.56mm (.140) Diameter Pin Terminal, Brass, 0.50mm (.020) Thickness, Wire Range 14-20 AWG (2.00-0.52mm2), 15.50mm (.610) Pitch, Unplated
|
Molex Electronics Ltd.
|
| HEDS-6500-A05 HEDS-6500-A10 HEDS-6500-A11 HEDS-650 |
HEDS-6510#005 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6505#B05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6500#A05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6500#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6505#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6545#B09 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6540#B11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6540#T11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
Large Diameter (56 mm), Housed Two and Three Channel Optical Enco
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| 0440671001 44067-1001 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-0201 0440670201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-0802 0440670802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
Molex Electronics Ltd.
|
| 44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| 44067-0601 0440670601 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| PE1001-3 |
Hermetic Seal Solder Contact With 0.018 Pin Diameter 0.112 Body Diameter And 0.18 Pin Length
|
Pasternack Enterprises, Inc.
|
| PE1001-4 |
Hermetic Seal Solder Contact With 0.02 Pin Diameter, 0.158 Body Diameter And 0.07 Pin Length
|
Pasternack Enterprises, Inc.
|
| 0440672402 44067-2402 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 87609-0071 0876090071 |
1.27mm (.050) Pitch DIMM 8-Byte Socket, Right Angle, Multi-Key, 168 Circuits, with Beveled Metal Pins and Plastic Pegs, with Beige Latches, 3.56mm (.140) Tail Length
|
Molex Electronics Ltd.
|
| PDSP16488AMAACBR |
JT 15C 14#20 1#16 PIN WALL REC
|
Mitel Networks Corporation
|
|
